In IC packing process, the first step is back-grinding. After back-grinding wafers will be cut into small chops, then these chips will be packed to be ICs. It is rather vital to maintain a stable grinding rate and qualified surface. When wafers are ground to be thinner, to keep a good thickness uniformity is very important to get a higher packing yield.

Application: Back grinding of silicon and compound semiconductor wafers.

Features:

1. Specialized bond design and manufacturing technology guarantee the cutting rate stability.
2. Excellent grinding wheels self-sharpen ability helps to reduce the risk of wafer breaking.
3. Accurate graded diamond and strict production management enable customers to get a stable ground surface quality of water.

Note: we can offer other specifications according to your drawing or sample.

Please indicate the following information when placing a new order.

1 specification

2 quantity

3 other requirements